Bioenno Electronics, the next evolution of our previous electronics division is the newly revamped branch (subsidiary) dedicated to research, development and manufacturing of advanced electronics  technologies.

Founded in 2012, Bioenno Electronics subsidiary possesses its own dedicated capabilities and facilities for manufacturing and development as well as its own dedicated staff. Its business covers:

(1) Advanced materials manufacturing of electronic components and packages (hybrid electronic packaging), including hermetically joining/packaging. Based on this class of technology, Bioenno Electronics also provides the manufacturing services of microwave/RF components and packages along with  biomedical devices’ components and packages.

(2) Nano-processing that include  ceramic/metallic nanocoating, nanoparticles , and RF nanocomposites.

(3) 3-D printing for various applications including RF devices such as  antenna array and energy device ; and

(4) Optical modulators, photodetectors and IR sensors/detectors.

Bioenno Electronics has the capabilities, experience and technical knowledge to pursue advancements in technology with the ultimate goal of transforming recent laboratory developments into fully realized products.  Our research efforts have also been sponsored through U.S DoE and DoD SBIR programs.  Recent SBIR projects including graphene-based modulators and  nano-processing based magneto dielectric materials (MDMs) that can be used to manufacture miniaturized RF devices.

In addition to its own research, development and manufacturing activities, this subsidiary also actively engages in joint research and development projects, commissioned research and development projects and design projects, and joint or commissioned manufacturing. Our experience and expertise allow us to provide research, development capabilities and technical know-how that the industry needs in order to advance.

Please contact us for questions, comments or general inquiries regarding our research, products, and services.